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PCB Fabrication Service

We have top-level equipment and advanced process technology, no matter how complex the PCB,

 

We can quickly provide manufacturing services according to customer requirements.

 

And has a senior engineering technical team,

 

according to the customer’s design to make fabrication  in a low-cost manner

 

Introduction to HCH-PCB Fabrication Service

 

HCH-PCB offers top quality Printing Circuit Boards (PCB) including multi-layer PCB (printed circuit board),

 

high-level HDI(high density inter-connector), arbitrary-layer PCB and rigid-flexible PCB…etc.

 

As a base material, HCH-PCB understands the importance of reliable quality of the PCB.

 

We invest in best equipments and talented team to produce best quality boards.

 

HCH-PCB manufacturing capabilities are shown in the chart below.

 

Type

Capability

Scope

Multilayers(4-70)、HDI(4-48)Flex、Rigid Flex

Double Side

CEM-3、 FR-4、Rogers RO4233、Bergquist Thermal Clad 4mil–126mil (0.1mm-3.2mm)

Multilayers

4-70 layers, board thickness 8mil-126mil (0.2mm-3.2mm)

Buried/Blind Via

4-48 layers, board thickness 10mil-126mil(0.25mm-3.2mm)

HDI

1+N+1、2+N+2、3+N+3、Any layer

Flex & Rigid-Flex PCB

1-8layers Flex PCB ,2-12layers Rigid-flex PCB HDI+Rigid-flex PCB

Laminate

Soldermask Type(LPI)

Taiyo、Goo’s、Probimer FPC…..

Peelable Soldermask

Carbon ink

HASL/Lead Free HASL

Thickness: 0.5-40um

OSP

ENIG (Ni-Au)

Electro-bondable Ni-Au

Electro-nickel palladium Ni-Au

Au: 0.015-0.075um Pd 0.02-0.075um Ni:2-6umm

Electro. Hard Gold

Thick tin

Capability

Mass Production

Min Mechanical Drill Hole

0.20mm

Min. Laser Drill Hole

4mil (0.100mm)

Line Width/Spacing

2mil/2mil

Max. Panel Size

21.5″ X 24.5″(546mm X 622mm)

Line Width/Spacing Tolerance

Non electro coating:+/-5um,Electro coating:+/-10um

PTH Hole Tolerance

+/-0.002inch(0.050mm)

NPTH Hole Tolerance

+/-0.002inch(0.050mm)

Hole Location Tolerance

+/-0.002inch(0.050mm)

Hole to Edge Tolerance

+/-0.004inch(0.100mm)

Edge to Edge Tolerance

+/-0.004inch(0.100mm)

Layer to Layer Tolerance

+/-0.003inch(0.075mm)

Impedance Tolerance

+/- 10%

Warpage %

Max≤0.5%

 

     Technology for HDI PCB

 

ITEM

Production

Laser Via Drill/Pad

0.125/0.30 、 0.125/0.38

Blind Via Drill/Pad

0.25/0.50

Line Width/Spacing

0.10/0.10

Hole Formation

CO2 Laser Direct Drill

Build Up Material

FR4 LDP(LDD); RCC 50 ~100 micron

Cu Thickness on Hole Wall

Blind Hole: 10um(min)

Aspect Ratio

0.8 : 1

 

     Technology  for Flexible PCB

 

Project 

Ability

Roll to roll (one side)

YES

Roll to roll (double)

NO

Volume to roll material width mm

250

Minimum production size mm

250×250

Maximum production size mm

500×500

SMT Assembly patch (Yes/No)

YES

Air Gap capability (Yes/No)

YES

Production of hard and soft binding plate(Yes/No)

YES

Max layers(Hard)

10

Tallest layer(Soft plate)

6

Material Science 

PI

YES

PET

YES

Electrolytic copper

YES

Rolled Anneal Copper Foil

YES

PI

Covering film alignment tolerance mm

±0.1

Minimum covering film  mm

0.175

Reinforcement 

PI

YES

FR-4

YES

SUS

YES

EMI SHIELDING

Silver Ink

YES

Silver Film

YES

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Addr: No.2095, Shihong Industry Park, Bixin Rd, Longgang Dist, Shenzhen, Guangdong, China
Email: info@hch-pcb.com
Tel: +86-13068787522