HCH-PCB provides rapid and reliable turnkey Electronic Contract Manufacturing (EMS) services.
Our one-stop turnkey service cover as everything from electronic design of the circuits, PCB layout, PCB fabrication,
component sourcing, parts procurement and PCB assembly. our PCB Assembly services also specialize in prototyping
and small-volume production, making HCH-PCB the one-stop destination of PCBs fabrication and assembly.
This services makes your R&D work easy and time-saving. Served thousands of satisfied orders daily all over
the world, Due to our reliable quality and excellent service, we have been into one of the best suppliers of PCB and
PCBA services in the world.
The typical PCB assembly process are below:
• IQC • Automatic solder paste printing
• SPI • SMT
• Reflow soldering • AOI
• X-RAY (for BGA) • ICT testing
• DIP through hole • Wave soldering
• Board cleaning • Firmware Programming
• Function Testing • Coating (if needed)
Our advanced assembly equipment enables us to quickly meet all your PCBA needs in a low-cost manner.
Our PCB assembly capabilities are as follows:
Supported Capabilities | |
Types of Assembly | SMT (Surface-Mount Technology) |
THD (Thru-Hole Device) | |
SMT & THD mixed | |
Double sided SMT and THD assembly | |
SMT capability | PCB layer: 1-48 layers; |
PCB material:FR-4,CEM-1, CEM-3,High TG,FR4 Halogen Free,FR-1,FR-2, Aluminum Boards; | |
Board type: Rigid FR-4, Rigid-Flex boards | |
PCB thickness: 0.2mm-7.0mm; | |
PCB dimension width: 40-500mm; | |
Copper thickness: Min:0.5oz; Max: 6.0oz; | |
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm; | |
Component size: 0.6*0.3mm-33.5*33.5mm; | |
Component height: 6mm(max); | |
Pin spacing laser recognition over 0.65mm; | |
High resolution VCS 0.25mm; | |
BGA spherical distance: ≥0.25mm; | |
BGA Globe distance: ≥0.25mm; | |
BGA ball diameter: ≥0.1mm; | |
IC foot distance: ≥0.19mm; | |
Component Package | Reels |
Cut tape | |
Tube and tray | |
Loose parts and bulk | |
Board shape | Rectangular |
Round | |
Slots and Cut outs | |
Complex and Irregular | |
Assembly process | Lead-Free (RoHS, REACH) |
Design file format | Gerber |
BOM (Bill of Materials) (.xls,.CSV, . xIsx) | |
Coordination (Pick-N-Place/XY file) | |
Electrical testing | AOI (Automated Optical Inspection), |
X-ray Inspection | |
ICT (In-Circuit Test)/ Functional testing | |
Reflow Oven profile | Standard |
Custom |