IC Test PCB

IC Test PCB

The semiconductor manufacturing process includes electrical testing steps that serve to ensure quality. These tests

use probe cards and IC test sockets as electrode contact jigs. The former are used in wafer-level (upstream process) testing,

while the latter are used in post-packaging (downstream process) testing. These components have multiple contact pins,

and a defect affecting the contact reliability of even one pin will compromise the integrity of the test. As a result,

manufacturers must test probe cards and IC test sockets to verify their reliability.

The IC test HDI PCB is one of the series HDI PCB developed and produced by HCH-PCB. This type of circuit board is made

of Shengyi S1000-2M material, manufactured by laser drilling, surface immersion and other processes, and the smallest

aperture can reach 0.1mm, the minimum line width and line spacing can reach 127/85um.

The HDI board is widely used in the field of IC testing.

Product introduction:

Advanced Technology

• Up to 70 layer processing technology, the minimum trace and space is 2.5 / 2.5mil, the highest  ratio of board

      thickness and hole diameter is 15:1.Long and short gold finger processing technology and high-density trace’s

     precision control to meet the design requirements of photoelectric communication products.

• High-precision back-drilling technology to reduce the equivalent series inductance of vias and in case to meet the

      product’s integrity requirements of signal transmission;

• Advanced metal-based and ultra-thick copper manufacturing process to meet the high heat dissipation

      requirements of power products.

• High-precision mechanical and laser depth control technology to achieve multi-level step groove product’s structure

      and meet the different levels of assembly requirements.

• The mature mixed pressure process realizes the mixing of FR-4 and high-frequency materials, and saves the material

      cost for customers under the premise of achieving the high-frequency performance of the products.

• Advanced Anti-CAF process technology greatly improves the reliability and service life of PCB products.

• Advanced buried capacitor and buried resistor technology greatly improve the performance of PCB products.

• Advanced inner layer exposed technology meets the information transmission requirements of high frequency circuits.

Strict Quality Control

• UL certification.

• ISO9001:2008 quality certification.

• ISO/TS1694:2009 certification.

• Strictly manage the processing of customized products according to IPC6012 II /III/customer standard/enterprise

      internal standard.

• Strict management for customer information confidentiality.

Advanced Processing And Testing Equipment

• Orbotech AOI (automatic optical inspection) machine imported from Israel for detecting high-precision circuits.

• The high-precision impedance tester imported from the United States meets the impedance test requirement

• .PLASMA plasma processing equipment, used for hole wall degumming of PTFE, ceramic fillers and other 

      high-frequency material.

• Ende CNC drilling machine imported from Taiwan for back drilling and deep hole control.

• Orbotech LDI machine (laser direct imaging) imported from Israel for graphic transfer of high-precision circuits.

• Ende CNC numerical control molding machine imported from Taiwan, used for deep-groove milling of stepped

      groove structure products.

• BURKLE lamination imported from Germany for multi-layer boards pressing.

• Vacuum resin plugging machine for hole plug in BGA panel of ultra high-precision circuits.

• Ion staining tester, anti-stripping strength tester, hole copper tester, secondary element tester, copper thickness

       tester and other reliability testing equipment to ensure product quality.

High-quality Raw Materials

• PCB substrate materials: Select the top brands in the industry: Shengyi, ROGERS, ARLON, TACONIC, 3M, Omega, etc.

• Auxiliary materials: Rohm and Haas electroplating syrup, Hitachi dry film, Taiyo ink, Noda resin, etc.