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HDI PCB
HDI PCB

HDI PCB

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HDI PCB Board

 

High density interconnect PCBs are a way of making more room on your PCB to make them more efficient and allow

 

for faster transmission. It’s relatively easy for most enterprising companies that are using printed circuit boards to

 

see how this can benefit them.

 

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the PCB market. Because

 

of its higher circuitry density, the HDI technology can incorporate finer lines and spaces, smaller vias and capture

 

pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains

 

microvias that are .006 in diameter or even less

 

HDI PCB

 

Features of HDI PCB Board:

 

Key HDI PCB Benefits

 

The evolution of PCB HDI technology has given engineers greater design freedom and flexibility than ever before.

 

Designers using HDI high density interconnect methods now can place more components on both sides of the raw

 

PCB if desired. In essence, an HDI PCB gives designers more space to work with, while allowing them to place

 

smaller components even closer together. This means that a high-density interconnect PCB ultimately results in

 

faster signal transmission along with enhanced signal quality.

 

HDI PCB is widely used to reduce the weight and overall dimensions of products, as well as to enhance the electrical

 

performance of the device. The high-density PCB is regularly found in mobile phones, touch-screen devices, laptop

 

computers, digital cameras and 4G network communications. The HDI PCB is also prominently featured in medical

 

devices, as well as various electronic aircraft parts and components. The possibilities for high-density interconnect

 

PCB technology seem almost limitless.

 

HDI PCB Applications

 

HDI boards are appropriate for a wide range of industries. As mentioned above, you’ll find them in all types of digital

 

devices, like smartphones and tablets, where miniaturization is key to the effective application of the product. You can

 

also find high-density interconnect PCBs in automobiles, aircraft and other vehicles that rely on electronics.

 

One of the most critical areas where the high-density PCB is making huge inroads is in the medical arena. Medical

 

devices frequently need small packages with high transmission rates that only HDI PCBs can supply. For example,

 

an implant needs to be small enough to fit in the human body, but any electronics involved in that implant absolutely

 

must efficiently allow for high-speed signal transmission. Here, the HDI PCB indeed is a godsend. HDI PCBs can also

 

be useful in other medical equipment, like emergency room monitors, CT scans and much more.

 

No matter your industry, you’re probably already getting some ideas about how high-density interconnect PCBs can

 

make the electronics you produce or use even better – get in touch with us PCBCart to discuss it. We’ll let you know

 

if you’re on the right track and help you decide exactly how beneficial an HDI PCB can be to your industry. Then, you

 

can determine whether or not to take the next step.

 

High Density PCBs of Impeccable Quality

 

Over the course of a decade in business, HCH-PCB has established a hard-earned reputation for manufacturing PCBs

 

of the highest quality. Our custom PCB manufacturing capabilities enable you to get the finest quality HDI PCBs at

 

competitive prices without min order quantity requirement. Our team run design for manufacture check on your

 

custom PCB file and consult with you to ensure it is ready for manufacturing and that your boards will meet your

 

performance requirements. We also have an on-site quality control department to verify the finished product meet

 

your high quality standards.

 

We’re capable of manufacturing HDI PCB up to 56 layers in various structures, check the following table for our

 

available HDI PCB structures:

 

No. ITEM Description Data & Model
1 Material Brand SYITEQKBNOUYA
2 HDI Construction 1+N+12+N+23+N+34+N+45+N+56+N+6anylayer
3 Construction order N+NN+X+N1+(N+X+N)+1
4 Layer 1-56 Layers
5 Min Pattern Width / Spacing Unitmil 2/2
6 Min Mechanical Hole Unitmm 0.15mm
7 Min Thickness of Core Board Unitmil 2mil
8 Laser Hole Unitmm 0.075mm- 0.1mm
9 Min thickness of PP Unitmil 2mil
10 Max diameter of resin plug hole Unitmm 0.4mm
11 Electroplating to fill holes Can do it.
12 Electroplating to fill holes size Unitmil 3-5mil
13 hole pile pad/hole pile hole/pad hole(VOP) mil Can do it.
14 The distance from the wall of via hole to the mil 7mil
pattern
15 Laser drilling hole accuracy mil 0.025mm
16 Min BGA pad center distance mil 0.3mm
17 Min SMT mil 0.25mm
18 Plating hole-filling sag mil ≤10um
Technical support or quotation service, please contact. Email: sales@hch-pcb.com Web: www.hch-pcb.com 1/2
19 Back drilled/countersink hole tolerance mil ±0.05mm
20 Through-hole plating penetration capacity Rate 16:1
21 Blind hole plating penetration capacity Rate 1.2:1
22 BGA min PAD Unitmil 0.2
23 Min Buried Hole(Mechanical Hole) Unitmil 0.2
24 Min Buried Hole(Laser Hole) Unitmil 0.1
25 Min Blind Hole(Laser Hole) Unitmil 0.1
26 Min Blind Hole(Mechanical Hole) Unitmil 0.2
Minimum spacing between laser blind hole
27 and mechanical buried hole Unitmil 0.2
28 Min Laser Hole Unitmil 0.10(depth≤55um)0.13(depth≤100um)
29 MinBGA pad center distance Unitmil 0.3
30 Interlaminar alignment Unitmil ±0.05mm(±0.002″)
The distance from the wall of via hole to the pattern

 

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