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IC Substrate PCB
IC Substrate PCB
IC Substrate PCB

IC Substrate PCB

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IC Substrate PCB


As one type of the most advanced PCB (Printed Circuit Board), IC substrate PCB has exploded in both popularity


and applications together with any layer HDI PCB and flex-rigid PCB, now widely applied in telecommunications


and electronics updates.  IC substrate is a kind of substrate used to package bare IC (integrated circuit) chips,


connecting chips and circuit boards.




What is the divination of IC substrate of PCB?


IC substrate is a type of base board used to package bare IC (integrate circuit) chip. Connecting chip and circuit


board, IC belongs to an intermediate product with the following functions:


  • it captures semiconductor IC chip;


  • there’s routing inside to connect chip and PCB;


  • it can protect, reinforce and support IC chip, providing thermal dissipation tunnel.


What are the classifications of IC substrate of PCB?


Classified by package types


  • BGA IC Substrate. This kind of IC Substrate performs well in thermal dissipation and electrical performance


  • and can dramatically increase chip pins. Therefore, it is suitable for IC package with pin count exceeding 300.


  • CSP IC Substrate. CSP is a type of single chip package with light weight and miniaturized scale, featuring


  • similarly size with IC. CSP IC substrate is mainly used in memory products, telecommunication products


  • and electronic products with a small number of pins.


Classified by package types


  • FC IC Substrate. FC (Flip Chip) is a type of package by flipping chip, featuring low signal interference, low circuit


    loss, well-performed performance and effective thermal dissipation.


  • MCM IC Substrate. MCM is an abbreviated form of multi-chip module. This type of IC substrate absorbs chips


     with different functions into one package. As a result, the product can be an optimal solution due to its attributes


     including lightness, thinness, shortness and miniaturization. Naturally, since multiple chips are packaged into


     one package, this type of substrate doesn’t perform so well in signal interference, thermal dissipation,


     fine routing etc.


Classified by material attribute


  • Rigid IC Substrate. It is primarily made by epoxy resin, BT resin or ABF resin. Its CTE (coefficient of


     thermal expansion) is approximately 13 to 17ppm/°C.


  • Flex IC Substrate. It is primarily made by PI or PE resin and features CTE 13 to 27ppm/°C


  • Ceramic IC Substrate. It is primarily made by ceramic materials such as Aluminium oxide, Aluminum nitride


     or silicon carbide. It features a relatively low CTE which is approximately 6 to 8ppm/°C


Classified by bonding technology


  • Wire Bonding


  • TAB (Tape Automated Bonding)


  • FC Bonding


What is the application of IC substrate of PCB?


IC substrate PCBs are mainly applied on electronic products with light weight, thinness and advancing functions,


such as smart phones, laptop, tablet PC and network in fields of telecommunications, medical care, industrial control,


aerospace and military.



Rigid PCBs have followed through a series of innovations from multilayer PCB, traditional HDI PCBs,


SLP (substrate-like PCB) to IC substrate PCBs. SLP is just a type of rigid PCBs with similar fabrication process


approximately semiconductor scale.




What are the difficulties of IC substrate manufacturing?


Compared with standard PCB, IC substrate has to conquer manufacturing difficulties for its implementations of high


performance and advanced functions.


IC Substrate Manufacturing


IC substrate is thin and easy to be deformed, which is especially protruding when a board is less than 0.2mm thick.


To overcome this difficulty, breakthroughs have to be made in terms of board shrinking, lamination parameters and


layer positioning system so that substrate warpage and lamination thickness can be effectively controlled.


Microvia Manufacturing Technology


Microvia technology consists of the following aspects: conformal mask, laser-drilled micro blind via technology and


plated copper filling technology.


  • Conformal Mask aims to logically compensate laser-drilled blind via opening and blind via aperture and positions


     can be directly defined through copper openings.


  • Laser-Drilled Microvia fabrication is correlated with the following technological aspects: via shape, aspect ratio,


     side etching, left gel under via etc.


  • Blind Via Copper Plating is correlated with the following technological aspects: via filling capability, blind via


     openness, sinking, copper plating reliability etc.

Patterning and Copper Plating Technology


Patterning and copper plating technology is correlated with the following technological aspects: circuitry


compensation technology and control, fine line fabrication technology, copper plating thickness uniformity control.


Solder Mask


Solder mask manufacturing for IC substrate PCB consists of via filling technology, solder mask printing


technology etc. Up to now, IC substrate PCB allows less than 10um for surface height difference and surface


height difference between solder mask and pad should not be over 15 um.


Surface Finish


Surface finish for IC substrate PCB should emphasize thickness uniformity and up to now, surface finish that


can be accepted by IC substrate PCB includes ENIG/ENEPIG.


Inspection Capability and Product Reliability Test Technology


IC substrate PCB calls for inspection equipment that is different from that used for traditional PCB. In addition,


engineers have to be available that are capable of mastering inspection skills on the special equipment.

HCH-PCB IC Substrate Technical Capability detail as below:


No. Item Description Data & Model
1 Sheng Yi Core Brand SI643HU、SI10U、SI09U、SI07U、SI05U
2 Mitsubishi Gas Chemical Core Brand HL832NXA、HL832NS、HL832NSR(LC)
3 DooSan Core Brand DS-7409HGB(S)、DS-7409HGB(LE)、DS-7409HGB(X)
4 Panasonic Core Brand R1515E/R1515H、
5 Layer 1-8layer
6 Min pattern size um 25
7 Min pattern Space um 25
8 Min Pad um 80
9 Min BGA Center Space um 250
10 2L Min Thickness um 80
11 2L Min thickness/core/PP Thickness um 80/30
12 4L Min thickness/core/PP Thickness um 150/30/20
13 6L Min thickness/core/PP Thickness um 210/30/20
14 8L Min thickness/core/PP Thickness um 300/30/20
15 Soldermask Color Green, Black
16 SM Ink EG23A、AUS308、AUS320、AUS410
14 Surface treatment Soft Gold Plating,Hard Gold Plating,ENIG,OSP
18 Flatness um 5max
19 Min hole size um 100
20 Min Laser hole size um 50
21 Min thickness tolerance um 30
22 Min PP um 25
23 Min Core um 40
24 Minimum Finger Center Distance um 65
25 Min para-position accuracy um 15
26 Support Process Subtraction process, mSAP Process
27 Soldermask tolerance um 5


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